WA_DEV_GL6100_PTS_001 Rev 004 November 30, 2010 75
GL61x0 Product Technical
Specification and User Guide
Reliability Standards: Compliance and
Recommendations
13.4.6. Handling Resistance Stress Tests
The following tests the GL61x0’s resistance to handling malfunctions and damages.
Table 60. Handling Resistance Stress Tests
Special conditions:
Contact discharges: 10 positive and 10 negative applied
Voltage: ±2kV, ±4kV, ±6kV
Operating conditions: Powered
Operational Durability
OD
Special conditions:
SIM Connector:
Cycles : 40
Repetition Rate : 3s per cycle
Objective : Mating and de-mating
System Connector:
Cycles : 40
Repetition Rate : 3s per cycle
Objective : Mating and de-mating
RF Connector :
Cycles : 20
Repetition Rate : 5s per cycle
Objective : Mating and de-mating
Operating conditions: Un-powered
Standard : IEC 60068-2-32, Test Ed
Special conditions:
Drop: 2 samples for each direction
Equivalent drop height: 1.5m
Number of directions: 6 (±X, ±Y, ±Z)
Number of drops/face: 2
Operating conditions: Un-powered
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